Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ki Young Um0
Date of Patent
January 4, 2011
0Patent Application Number
120585430
Date Filed
March 28, 2008
0Patent Primary Examiner
Patent abstract
A semiconductor wafer and a method for cutting the same are provided, which enable separation of the semiconductor wafer by natural cleavage planes. The cutting method includes preparing a substrate including a semiconductor layer with at least one projection, formed on a predetermined area thereof; forming a post on an upper surface of the semiconductor layer at one or both sides of the projection to be placed on a cleaving line for cutting of the semiconductor layer; and cutting the substrate including the semiconductor layer along the cleaving line by performing a scribing process in a direction from the substrate and a breaking process in a direction from the semiconductor layer.
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