US Patent 7863719 Wafer level chip scale package
Patent 7863719 was granted and assigned to Fujikura on January, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 2, 2010
0
Date of Patent
January 4, 2011
0
Patent Application Number
12848652
0
Patent Inventor Names
Koji Munakata
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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