Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 4, 2011
Patent Application Number
11886755
Date Filed
March 28, 2006
Patent Primary Examiner
Patent abstract
An electronic assembly includes an electronic circuit on a circuit board. The circuit includes a conductor path on the circuit board, and at least one SMD component, electronic component and/or electromechanical component that is mounted on the circuit board and connected to the conductor path. A circuit connection between any two of the conductor paths and/or the components is established via a soldered joint and a spring-loaded contact bridge. In the event of excessive power dissipation, the soldered joint melts or weakens and the contact bridge opens due to the spring force.
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