An earphone device integrated with a microphone has a main body, a microphone unit and a speaker unit. The microphone unit has a sound-absorbing film and a circuit unit, the sound-absorbing film being a hollow column and being connected to the main body through a rear end thereof, and the circuit unit being fixed on the main body and electrically connected to the sound-absorbing film. The speaker unit is mounted inside the sound-absorbing film of the microphone unit such that the microphone unit is located peripheral to the speaker unit. A microphone and an earphone can thus be integrated together as a whole so as to form an earphone device that can be used conveniently.