US Patent 7865165 Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers

Methods of forming scalable systems and scalable systems on an integrated circuit (SoC) are provided. First and second radio frequency (RF) systems are disposed on first and second substrates, respectively. A first processor that is configured to process the first RF system is disposed on a substrate separate from the first substrate and a second processor that is configured to process the second RF system is disposed on a substrate separate from the second substrate. The first processor and the first RF system are stacked one on top of the other to configure a first RFSoC and the second processor and the second RF system are stacked one on top of the other to configure a second RFSoC. The first and second RFSoCs are disposed either in a horizontal plane, laterally spaced from each other, or in vertically stacked planes, one above the other.