US Patent 7866376 Heat dissipation device with U-shaped and S-shaped heat pipes

A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.