US Patent 7867548 Thermal ejection of solution having solute onto device medium

A solution is provided that includes a non-aqueous organic solvent within which a solute has been dissolved. A thermal-fluid ejection mechanism is provided that has fluid-ejection nozzles and that is capable of thermally ejecting the solution. A device medium is provided that has a three-dimensional surface on which the solution is to be ejected. The fluid-ejection nozzles of the thermal fluid-ejection mechanism are controlled to eject the solution onto the three-dimensional surface of the device medium in accordance with a desired pattern.