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US Patent 7868441 Package on-package secure module having BGA mesh cap
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Patent
Date Filed
May 3, 2007
Date of Patent
January 11, 2011
Patent Application Number
11800175
Patent Citations Received
US Patent 12118553 Systems and methods for chip-based identity verification and transaction authentication
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US Patent 12093923 Microprocessor as a security layer
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US Patent 12093924 Secure cover with tamper resistant landing area
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US Patent 12094839 Systems and methods for the use of fraud prevention fluid to prevent chip fraud
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US Patent 11701725 Systems and methods for saw tooth milling to prevent chip fraud
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US Patent 11715103 Systems and methods for chip-based identity verification and transaction authentication
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US Patent 11853824 Metal card
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US Patent 11884051 Methods of making a core layer for an information carrying card, and resulting products
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US Patent 11989607 Systems and methods for use of capacitive member to prevent chip fraud
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Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
7868441
Patent Primary Examiner
Jarrett J Stark
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