US Patent 7868450 Semiconductor package

A semiconductor package includes a base plate having first and second surfaces both facing in opposite directions, and a plurality of anisotropic heat conducting members disposed in the base plate and spaced away from each other. A semiconductor element having a heat generating unit is mounted on the first surface, and the second surface is supported on a supporting member having a thermal conductivity. Each anisotropic heat conducting member has a sheet shape intersecting with the first and second surfaces, and orientates a direction of higher thermal conductivity than the thermal conductivity of the base plate in a direction from the first surface toward the second surface.