US Patent 7871865 Stress free package and laminate-based isolator package
Patent 7871865 was granted and assigned to Analog Devices on January, 2011 by the United States Patent and Trademark Office.
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Various methods are described where the semiconductor die and the lead frame (or the BGA or LGA substrate) are spaced apart to reduce stress. In one scenario, an air gap is formed between the semiconductor die and the lead frame by depositing a perimeter (made, for example, using polymer) either on the semiconductor die or the lead frame. In another scenario, an anisotropic conducting film (ACF) is formed with an air gap between the semiconductor die and the lead frame (or the BGA or LGA substrate). The air gap relieves stress on the semiconductor die. Further, a lead frame-based isolator package and a BGA (or LGA) isolator package are described. A window-frame ACF-based isolation method for magnetic coupling in a lead-frame package and BGA (or LGA) package is also described.
US Patent 07871865 Stress free package and laminate-based isolator package US Patent 7871865 Stress free package and laminate-based isolator package
US Patent 07871865 Stress free package and laminate-based isolator package
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