Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Atsushi Osawa0
Date of Patent
January 18, 2011
0Patent Application Number
122757400
Date Filed
November 21, 2008
0Patent Primary Examiner
Patent abstract
In an ultrasonic transducer array, a plurality of vibrators arranged in an array is bonded to a base plate by bond material. The bond material bonds the bottom of the each vibrator to the base plate in a manner to surround lower part of the side face of the vibrator. A filling material is filled in between the vibrators. The filling material has a multi-layer structure of different rigidity. In a double layer structure of the filling material, it is preferable that thickness ratio of layer of filling material at the base plate side (lower side) to the other layer of the filling material is 1:1 to 1:3. Preferably, a beam is provided for connecting the side faces of the adjacent vibrators.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.