Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takashi Yoshino0
Date of Patent
January 25, 2011
0Patent Application Number
123959080
Date Filed
March 2, 2009
0Patent Primary Examiner
Patent abstract
It is provided a chip having a supporting substrate, a wavelength conversion layer, a base adhesive layer made of an organic resin, an upper-side substrate provided on an upper surface side of the wavelength conversion layer, and an upper-side adhesive layer made of an organic resin for adhering the wavelength conversion layer to the upper-side substrate. The wavelength conversion layer has an optical waveguide with a periodic domain inversion structure provided therein. The chip is heat treated. Anti-reflection films are formed on an incident side end face and projection side end face of the optical waveguide, respectively.
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