Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 25, 2011
Patent Application Number
10853270
Date Filed
May 26, 2004
Patent Primary Examiner
Patent abstract
A mold assembly (100) formed of a pair of molds (102, 104) and a pair of release plates (118, 120). The molds (102, 104) have holes (126) which extend from outer surfaces into the mold cavities (106). The release plates (118, 120) have pins (122, 124) which pass into the holes (126, 128). When molding is finished, the molds (102, 104) are moved toward the release plates (118, 120). The pins (122, 124) contact the molded article(s) (134) and hold them in position as the molds (102, 104) are withdrawn.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
