Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 25, 2011
Patent Application Number
12615262
Date Filed
November 9, 2009
Patent Primary Examiner
Patent abstract
A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.
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