Patent attributes
An electronic component-inspection wiring board including a first laminate composed of plural first ceramic layers and having pads formed on a front surface to transmit inspection signals to an electronic component, wiring layers formed between the first ceramic layers , and via-conductors connecting pads to the wiring layers exposed on a rear surface of the first laminate; and a second laminate composed of second ceramic layers having plural via-conductors extending between front surface and rear surface of the second laminate, wherein lands connecting a via-conductor exposed on the rear surface of the first laminate and a via-conductor exposed on the front surface of the second laminate are disposed between the first laminate and the second laminate, and the diameter d1 of the land is 2-5 times larger than the diameter d2 of a via-conductor connected to the land.
