US Patent 7876562 Electronic module having thermal cooling insert

An electronic module is provided having enhanced thermal cooling of electronics. The module includes a housing, electronic circuitry contained within the housing, and a fluid cooling chamber extending through the housing. The chamber has generally conical shaped portions at opposite ends. At least one thermal cooling insert extends into the chamber. The insert comprises a plurality of projections for forming fluid flow passages between adjacent projections, wherein the projections engage the generally conical shape portion of the chamber.