US Patent 7877895 Substrate processing apparatus
Patent 7877895 was granted and assigned to Tokyo Electron on February, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film. Then, the substrate, with distribution of the predetermined component thus adjusted, is subjected to a heat process at a temperature not lower than the lower limit of temperature.
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US Patent 07877895 Substrate processing apparatus US Patent 7877895 Substrate processing apparatus
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Patent Number
0787789500
Patent Number
787789500
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
078778950
Date of Patent
February 1, 2011
0Patent Application Number
117571510
Date Filed
June 1, 2007
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078778950
Date of Patent
February 1, 2011
0Patent Application Number
117571510
Date Filed
June 1, 2007
0Official Website
Patent Primary Examiner
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US Patent 07877895 Substrate processing apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07877895
Date of patent
February 1, 2011
Patent application number
11757151
Date Filed
June 1, 2007
Patent primary examiner
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