Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takao Nishimura0
Kazuyuki Aiba0
Date of Patent
February 1, 2011
Patent Application Number
11969402
Date Filed
January 4, 2008
Patent Primary Examiner
Patent abstract
A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted, on the main surface of the wiring board; wherein a surface of the dam contacting the resin has a configuration where a curved line is continuously formed.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.