Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomoshi Ohde0
Yuji Nishitani0
Fujio Kanayama0
Hidetoshi Kusano0
Mitsuru Adachi0
Tetsunori Niimi0
Date of Patent
February 1, 2011
0Patent Application Number
120943140
Date Filed
October 30, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.
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