Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 1, 2011
Patent Application Number
12264301
Date Filed
November 4, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention is applied to a multilayer semiconductor device including a plurality of layered semiconductor chips. At least one of the plurality of layered semiconductor chips includes a pad that is not connected to any external circuit terminal of the multilayer semiconductor device. The multilayer semiconductor device also includes a separating element that connects the pad to a test stub line when each semiconductor chip is tested and separates the pad from the test stub line during the normal operation.
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