A tool is disclosed comprising a thin, ribbon-like but semi-rigid material which can be “snaked” in between ductwork and the surface to which it is attached. The tool is configured to enable the temporary attachment of a tape material thereon. Further, the tape material includes a non-adhesive “release tape” attached to the adhesive portion of the adhesive tape. Using the method and apparatus described herein, a user can insert the tape, with the protective tape release thereon, around the ductwork, release the tape and remove the tool, and use the tool as it is being withdrawn to urge the adhesive tape onto the seam being taped.