Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Chao Yang0
Fenton R. McFeely0
Date of Patent
February 8, 2011
0Patent Application Number
118509160
Date Filed
September 6, 2007
0Patent Primary Examiner
Patent abstract
A method of forming a noble metal cap on a conductive material embedded in a dielectric material in an interconnect structure. The method includes the step of contacting (i) a conductive material having a bare upper surface partially embedded in a dielectric material and (ii) vapor of a noble metal containing compound, in the presence of carbon monoxide and a carrier gas. The contacting step is carried out at a temperature, pressure and for a length of time sufficient to produce a noble metal cap disposed directly on the upper surface of the conductive material without substantially extending into upper surface of the dielectric material or leaving a noble metal residue onto the dielectric material.
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