Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
SeungYun Ahn0
Sungmin Song0
JoHyun Bae0
Date of Patent
February 8, 2011
0Patent Application Number
117686400
Date Filed
June 26, 2007
0Patent Primary Examiner
Patent abstract
An integrated circuit package system comprising: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.
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