US Patent 7885067 Heat radiation structure of electronic component and display device
Patent 7885067 was granted and assigned to Sony on February, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A heat radiation structure of an electronic component of the present invention includes a main board mounted with electronic components, an upper side heat sink disposed opposite to a top face of the main board, a lower side heat sink disposed opposite to a second face of the main board, and a cooling fan connected to the upper side heat sink and the lower side heat sink.
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Patent Inventor Names
Tatsuya Sakata0
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US Patent 07885067 Heat radiation structure of electronic component and display device US Patent 7885067 Heat radiation structure of electronic component and display device
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Patent Number
078850670
Patent Number
78850670
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Current Assignee
0
Patent Jurisdiction
Patent Number
078850670
Date of Patent
February 8, 2011
0Patent Application Number
122518030
Date Filed
October 15, 2008
0Official Website
Patent Primary Examiner
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US Patent 07885067 Heat radiation structure of electronic component and display device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07885067
Date of patent
February 8, 2011
Patent application number
12251803
Date Filed
October 15, 2008
Patent primary examiner
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