Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 15, 2011
Patent Application Number
12081862
Date Filed
April 22, 2008
Patent Primary Examiner
Patent abstract
A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
