Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Leonard Forbes0
Kie Y. Ahn0
Date of Patent
February 15, 2011
0Patent Application Number
125536910
Date Filed
September 3, 2009
0Patent Primary Examiner
Patent abstract
A method for forming conductive contacts and interconnects in a semiconductor structure, and the resulting conductive components are provided. In particular, the method is used to fabricate single or dual damascene copper contacts and interconnects in integrated circuits such as memory devices and microprocessor.
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