Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Tsung Lin0
Date of Patent
February 15, 2011
0Patent Application Number
121265880
Date Filed
May 23, 2008
0Patent Primary Examiner
Patent abstract
A thin film circuit board device includes: a first thin film circuit board having a first protrusion provided with a first conductive contact; a second thin film circuit board having a second protrusion provided with a second conductive contact; and an insulator film disposed between the first and second thin film circuit boards. The first and second protrusions are disposed one above the other. The insulator film is free of a portion that extends between the first and second protrusions. The first and second protrusions are folded together in such a manner that the first and second conductive contacts are brought into contact with each other at the fold thereof.
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