US Patent 7888790 Bare die package with displacement constraint

Embodiments of the present invention describe a bare die package and its methods of fabrication. The bare die package comprises a die electrically coupled to a package substrate, and a displacement constraint. In an embodiment of the present invention, the displacement constraint is a plurality of members fixedly attached onto the package substrate and surrounds the die. When the bare die package is secured between a socket and a heat sink, the plurality of members provide structural support to the package substrate and prevent excessive substrate warpage.