Patent attributes
A wide format print assembly is provided. The print assembly includes a plurality of printhead modules each having a printhead integrated circuit (IC). Each module has a plurality of micro-electromechanical nozzle arrangements on a wafer substrate for operatively ejecting printing fluid onto a print medium. Each module also has a capping device displaceable between a capping position to cap the nozzle arrangements and an operative position where the nozzle arrangements are exposed for printing The modules also have a printed circuit board (PCB) linked to a CMOS drive circuitry layer on the wafer substrate. The print assembly includes a plurality of ink reservoir moldings to supply the printhead modules with printing fluid, and control circuitry for controlling the nozzle arrangements via the printed circuit boards.
