Patent attributes
A weather resistant variable enclosure frame configured to enclose at least one electronic component is provided. The weather resistant variable enclosure frame includes a top and bottom endplate each having a channel on at least one side surface, and at least one cut-to-length supporting structure attached to the top endplate and the bottom endplate to offset the top endplate from the bottom endplate. The supporting structure has at least one channel that extends the length of the supporting structure. At least one opening is formed by the endplates and the supporting structure, so that the channels in the endplates and the at least one supporting structure combine to form at least one continuous channel configured to hold at least one respective continuous seal. When panels are attached to cover the at least one opening, a weather resistant enclosure is formed.
