Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Louis Lu-Chen Hsu0
Huilong Zhu0
Ping-Chuan Wang0
Xiaojin Wei0
Date of Patent
February 22, 2011
0Patent Application Number
123518780
Date Filed
January 12, 2009
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
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