Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Gareth Geoffrey Hougham0
Paul Coteus0
Brian R. Sundlof0
Date of Patent
March 1, 2011
0Patent Application Number
116274300
Date Filed
January 26, 2007
0Patent Primary Examiner
Patent abstract
A circuit package is provided. The circuit package includes a plurality of electrically conductive pads located on a bottom surface of the circuit package, wherein at least one pad of the plurality of bottom surface pads has a recession for receiving an electrically conductive protrusion located on a substrate to which the circuit package is to be mounted.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
