Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 1, 2011
Patent Application Number
11586644
Date Filed
October 26, 2006
Patent Primary Examiner
Patent abstract
A light source (2) and a connection base (1) are held with a predetermined gap, solder paste melted by the thermal energy of laser light is fed into the gap, and the light source (2) and the connection base (1) are bonded together via a solder layer (32).
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