Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
YoungJoon Kim0
YoRim Lee0
Date of Patent
March 1, 2011
Patent Application Number
12171890
Date Filed
July 11, 2008
Patent Primary Examiner
Patent abstract
A package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profile, on the package substrate and the step-down interposer.
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