Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toru Yamauchi0
Kenichi Seki0
Tatsuya Sakata0
Terutaka Yana0
Date of Patent
March 1, 2011
Patent Application Number
12325059
Date Filed
November 28, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.
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