US Patent 7902043 Method of producing bonded wafer
Patent 7902043 was granted and assigned to SUMCO on March, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A method of producing a bonded wafer, comprising: performing bonding of a first semiconductor wafer and a second semiconductor wafer without interposing an insulation film in between; and performing thinning of the second semiconductor wafer, wherein surface portions at least including bonded surfaces of the first semiconductor wafer and the second semiconductor wafer have an oxygen concentration of 1.0×1018 atoms/cm3 (Old ASTM) or less.
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US Patent 07902043 Method of producing bonded wafer US Patent 7902043 Method of producing bonded wafer
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Patent Number
0790204300
Patent Number
790204300
Edits on 31 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079020430
Date of Patent
March 8, 2011
0Patent Application Number
118559590
Date Filed
September 14, 2007
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079020430
Date of Patent
March 8, 2011
0Patent Application Number
118559590
Date Filed
September 14, 2007
0Official Website
Patent Primary Examiner
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US Patent 07902043 Method of producing bonded wafer
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07902043
Date of patent
March 8, 2011
Patent application number
11855959
Date Filed
September 14, 2007
Patent primary examiner
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