Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tatsuo Nishizawa0
Eiji Mochizuki0
Masafumi Horio0
Rikihiro Maruyama0
Date of Patent
March 8, 2011
Patent Application Number
12149114
Date Filed
April 28, 2008
Patent Primary Examiner
Patent abstract
A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.
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