US Patent 7902661 Integrated circuit micro-module
Patent 7902661 was granted and assigned to National Semiconductor on March, 2011 by the United States Patent and Trademark Office.
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Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to an integrated circuit package in which one or more integrated circuits are embedded in a substrate and covered with a layer of photo-imageable epoxy. The substrate can be made of various materials, including silicon, quartz and glass. An integrated circuit is positioned within a cavity in the top surface of the substrate. The epoxy layer is formed over the top surface of the substrate and the active face of the integrated circuit. An interconnect layer is formed over the epoxy layer and is electrically coupled with the integrated circuit.
US Patent 07902661 Integrated circuit micro-module US Patent 7902661 Integrated circuit micro-module
US Patent 07902661 Integrated circuit micro-module
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