Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Osamu Yamagata0
Date of Patent
March 8, 2011
0Patent Application Number
118908100
Date Filed
August 8, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor device in a packaged form including a semiconductor includes a semiconductor substrate with an active component disposed thereon and pads disposed on a surface thereof and connected to the active component, a first interconnection disposed on the semiconductor substrate and connected to the pads, a first insulating layer disposed on the semiconductor substrate in covering relation to the first interconnection and having an opening reaching a portion of the first interconnection, and a second interconnection disposed in the opening and on the first insulating layer and connected to the first interconnection.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
