Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 15, 2011
Patent Application Number
12045273
Date Filed
March 10, 2008
Patent Primary Examiner
Patent abstract
A polishing head for a chemical mechanical polishing apparatus is provided which includes at least two polishing head zones configured to provide different temperatures for transferring heat to at least two zones of a substrate corresponding to the at least two polishing head zones. The present disclosure addresses chemical mechanical polishing which allows a control of the polishing profile even if slurries are used, which show almost no dependency between polishing rate and down force.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
