Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael N. Miller0
Nicholas A. Stacey0
Byung-Jin Choi0
Mahadevan GanapathiSubramanian0
Michael P. C. Watts0
Date of Patent
March 15, 2011
0Patent Application Number
113037770
Date Filed
December 16, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for spreading a conformable material between a substrate and a template having a mold. The method comprises positioning the mold to be in superimposition with the substrate defining a volume therebetween. A first sub-portion of the volume is charged with the conformable material through capillary action between the conformable material and one of the mold and the substrate. A second sub-portion of the volume is filled with the conformable material by creating a deformation in the mold.
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