Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Octavio Trovarelli0
Bernd Zimmermann0
Martin Reiss0
Date of Patent
March 15, 2011
0Patent Application Number
117663260
Date Filed
June 21, 2007
0Patent Primary Examiner
Patent abstract
In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.
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