US Patent 7909908 Method of improving the weatherability of copper powder
Patent 7909908 was granted and assigned to DOWA Electronics Materials Co., Ltd. on March, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 μm and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
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US Patent 07909908 Method of improving the weatherability of copper powder US Patent 7909908 Method of improving the weatherability of copper powder
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Patent Number
0790990800
Patent Number
790990800
Edits on 27 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079099080
Date of Patent
March 22, 2011
0Patent Application Number
122859680
Date Filed
October 17, 2008
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079099080
Date of Patent
March 22, 2011
0Patent Application Number
122859680
Date Filed
October 17, 2008
0Official Website
Patent Primary Examiner
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US Patent 07909908 Method of improving the weatherability of copper powder
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07909908
Date of patent
March 22, 2011
Patent application number
12285968
Date Filed
October 17, 2008
Patent primary examiner
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