Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 22, 2011
Patent Application Number
11935099
Date Filed
November 5, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
In various embodiments, large-area sputtering targets are formed by providing a plurality of sputtering targets each comprising a backing plate and a refractory metal layer disposed thereon, and spray depositing a refractory metal powder on an interface between the sputtering targets, the refractory metal powder consisting essentially of the same metal as each refractory metal layer, thereby joining the refractory metal layers of the sputtering targets.
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