Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 22, 2011
Patent Application Number
12022292
Date Filed
January 30, 2008
Patent Primary Examiner
Patent abstract
Complementary metal gate dense interconnects and methods of manufacturing the interconnects is provided. The method comprises forming a first metal gate on a wafer and second metal gate on the wafer. A conductive interconnect material is deposited in a space formed between the first metal gate and the second metal gate to provide an electrical connection between the first metal gate and the second metal gate.
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