Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 22, 2011
Patent Application Number
11425826
Date Filed
June 22, 2006
Patent Primary Examiner
Patent abstract
A method for manufacturing a semiconductor device, including: (a) forming an energy cured resin layer on a semiconductor substrate having an electrode pad and a passivation film; (b) fusing the resin layer without being cured and shrunk by a first energy supply processing; (c) forming a resin boss by curing and shrinking the resin layer after fusion by a second energy supply processing; and(d) forming an electrical conducting layer which is electrically connected to the electrode pad and passes through over the resin boss.
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