Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 22, 2011
Patent Application Number
11863463
Date Filed
September 28, 2007
Patent Primary Examiner
Patent abstract
One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve the thermal cycling stability of the connection between a baseplate of the module and a circuit carrier connected thereto, recesses are provided in the baseplate. One aspect further relates to a power semiconductor module.
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