Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Keiichi Nakajima0
Date of Patent
March 22, 2011
0Patent Application Number
120789370
Date Filed
April 8, 2008
0Patent Primary Examiner
Patent abstract
A COF which can effectively dissipate the heat by using a simple structure and its manufacturing method. A semiconductor device of COF, which is formed over the main surface of a flexible substrate having no device hole and where a semiconductor chip is mounted over the inner lead interconnection, is characterized by forming a first resin layer over the second main surface of the flexible substrate opposite the side where the semiconductor chip is mounted and at the position corresponding to the semiconductor chip.
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