Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Reza Argenty Pagaila0
Byung Tai Do0
Heap Hoe Kuan0
Date of Patent
March 22, 2011
Patent Application Number
12238153
Date Filed
September 25, 2008
Patent Primary Examiner
Patent abstract
An integrated circuit package system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.
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