Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hyung Jin Park0
Date of Patent
March 29, 2011
0Patent Application Number
121166430
Date Filed
May 7, 2008
0Patent Primary Examiner
Patent abstract
A semiconductor device includes a fuse pattern formed as conductive polymer layer having a low melting point. The fuse pattern is easily cut at low temperature to improve repair efficiency. The semiconductor device includes first and second fuse connecting patterns that are separated from each other by a distance, a fuse pattern including a conductive polymer layer formed between the first and second fuse connection patterns and connecting the first and second fuse connection patterns, and a fuse box structure that exposes the fuse pattern.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.